GB/T 28275-2012
ActiveSilicon-based MEMS fabrication technology - Specification for KOH etch process
硅基MEMS制造技术 氢氧化钾腐蚀工艺规范
Application Summary AI generated
This standard specifies the technical requirements, process parameters, and quality control methods for the potassium hydroxide (KOH) anisotropic wet etching of silicon wafers in MEMS fabrication. It is applied in the semiconductor and microelectronics industries for producing microstructures such as cantilevers, membranes, and trenches in accelerometers, pressure sensors, and microfluidic devices. The standard ensures consistent etch rates, uniformity, and surface quality during batch processing in cleanroom manufacturing environments.
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