GB/T 27581-2011
ActiveElectromagnetic interference shielding Film - Electroless copper plating solution - Method of determining concentration of Ni2+ and Cu2+
电磁屏蔽膜 化学镀铜溶液 镍离子和铜离子含量测定方法
Application Summary AI generated
This standard specifies a method for determining the concentration of nickel ions (Ni2+) and copper ions (Cu2+) in electroless copper plating solutions used to produce electromagnetic interference (EMI) shielding films. It is applied in the manufacturing and quality control of electronic components, particularly for flexible printed circuit boards and consumer electronics, where precise bath chemistry is critical for consistent shielding performance. The method ensures the plating solution maintains optimal ion concentrations to achieve uniform, conductive copper layers for effective EMI protection.
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