GB/T 20254.2-2015
ActiveCopper and copper alloy strips for lead frame—Part 2: Profiled strip
引线框架用铜及铜合金带材 第2部分：异型带
Application Summary AI generated
This standard specifies the requirements, test methods, inspection rules, and packaging for profiled copper and copper alloy strips used in lead frames. It is applied in the semiconductor and electronics industries for manufacturing lead frames that support and connect integrated circuit (IC) chips. The standard ensures dimensional precision, mechanical properties, and surface quality for high-reliability electronic packaging.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.