GB/T 17473.7-2008
AbolishedTest methods of precious metals pastes used for microelectronics - Determination of solderability and solderelaching resistance
微电子技术用贵金属浆料测试方法 可焊性、耐焊性测定
Application Summary AI generated
This standard specifies test methods for evaluating the solderability and resistance to solder leaching of precious metal pastes used in microelectronics. It is applied in the manufacturing and quality control of thick-film hybrid circuits, chip resistors, and multilayer ceramic capacitors to ensure reliable solder joint formation and long-term durability during assembly processes.
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