GB/T 17473.4-2008
AbolishedTest methods of precious metals pastes used for microelectronics - Determination of adhesion
微电子技术用贵金属浆料测试方法 附着力测定
Application Summary AI generated
This standard specifies the test method for determining the adhesion strength of precious metal pastes applied to substrates in microelectronics. It is used in the manufacturing and quality control of hybrid integrated circuits, thick-film resistors, and other electronic components where reliable bonding between the paste and ceramic or silicon substrates is critical. The standard ensures consistent evaluation of paste performance under specified conditions, such as peel or pull testing, for process validation and material selection.
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