GB/T 17472-2008
AbolishedSpecification for pastes of precious metal used for microelectronics
微电子技术用贵金属浆料规范
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and packaging for precious metal pastes used in microelectronics. It is applied in the manufacturing of thick-film hybrid integrated circuits, chip resistors, multilayer ceramic capacitors, and other electronic components where conductive, resistive, or electrode layers are formed by screen printing and firing. The standard ensures consistent quality and performance of pastes containing gold, silver, platinum, or palladium in production and quality control environments.
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