GB/T 16525-2015
ActiveSemiconductor integrated circuits—Specification of leadframes for plastic leaded chip carrier package
半导体集成电路 塑料有引线片式载体封装引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, dimensions, materials, and testing methods for leadframes used in plastic leaded chip carrier (PLCC) packages. It is applied in the manufacturing and quality inspection of semiconductor integrated circuits, ensuring compatibility and reliability in surface-mount assembly processes for consumer electronics, telecommunications, and industrial control products.
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