GB/T 15879.604-2023

Active

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
2023-05-23
Implementation
2023-09-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家市场监督管理总局、国家标准化管理委员会

Application Summary AI generated

This standard specifies the measuring methods for package dimensions of ball grid array (BGA) semiconductor devices. It is applied in the electronics industry for the mechanical standardization and quality control of surface mounted semiconductor device packages, ensuring consistent outline drawings and dimensional accuracy during manufacturing and procurement.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.