GB/T 15879-1995
AbolishedMechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits
半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值
Application Summary AI generated
This standard provides mechanical specifications and recommended values for tape automated bonding (TAB) of integrated circuits, covering dimensions, tolerances, and material requirements for the tape and bonding interfaces. It is applied in the semiconductor manufacturing industry to ensure consistent mechanical compatibility between IC chips and TAB tape carriers during automated assembly processes. The standard is used by engineers and procurement professionals to define and verify the mechanical parameters of TAB components for high-volume production of integrated circuits.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.