GB/T 15878-2015
ActiveSemiconductor integrated circuits—Specification of leadframes for small outline package
半导体集成电路 小外形封装引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, dimensions, materials, and testing methods for leadframes used in small outline packages (SOP) for semiconductor integrated circuits. It is applied in the design, manufacturing, and quality inspection of leadframes to ensure compatibility with automated assembly processes and reliability in electronic devices such as consumer electronics, telecommunications equipment, and automotive systems.
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