GB/T 15877-2013
ActiveSemiconductor integrated circuits—Specification of DIP leadframes produced by etching
半导体集成电路 蚀刻型双列封装引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, test methods, inspection rules, and marking for dual in-line package (DIP) leadframes produced by the etching process. It is applied in the manufacturing and quality control of semiconductor integrated circuits, specifically for DIP leadframes used in electronic devices. The standard ensures dimensional accuracy, material properties, and reliability for leadframes in consumer electronics, automotive systems, and industrial equipment.
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