GB/T 15876-2015
ActiveSemiconductor integrated circuits—Specification of leadframes for plastic quad flat package
半导体集成电路 塑料四面引线扁平封装引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, dimensions, materials, and testing methods for leadframes used in plastic quad flat packages (PQFP) for semiconductor integrated circuits. It is applied in the design, manufacturing, and quality inspection of leadframes to ensure compatibility with automated assembly processes and reliable electrical connections in consumer electronics, telecommunications, and industrial control products. The standard is particularly relevant for procurement and engineering teams in the semiconductor packaging industry.
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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.