GB/T 14862-1993

Active

Junction-to-case thermal resistance test methods of packages for semiconductor integrated circuits

半导体集成电路封装结到外壳热阻测试方法

Standard Type
GBT
ICS
31.200
CCS
L55
Status
Active
Issue Date
1993-12-30
Implementation
1994-10-01
Centralized Committee
工业和信息化部(电子)
Issuing Authority
国家技术监督局

Application Summary AI generated

This standard specifies the test methods for measuring the junction-to-case thermal resistance of semiconductor integrated circuit packages. It is applied in the electronics industry for quality control and thermal performance evaluation of IC packages, particularly during design validation and manufacturing. The standard ensures consistent testing conditions to compare thermal dissipation capabilities across different package types.

Related Standards

Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.