GB/T 14112-2015
ActiveSemiconductor integrated circuits—Specification for stamped leadframes of plastic DIP
半导体集成电路 塑料双列封装冲制型引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, dimensions, materials, and testing methods for stamped leadframes used in plastic dual in-line package (DIP) semiconductor integrated circuits. It is applied in the manufacturing and quality control of leadframes for DIP-type ICs, ensuring compatibility with automated assembly processes and reliability in electronic devices. The standard is primarily used by semiconductor packaging factories and procurement teams to verify product specifications and performance.
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