GB/T 14112-1993
AbolishedSemiconductor integrated circuits--Specification for stamped leadframes of plastic DIP
半导体集成电路 塑料双列封装冲制型引线框架规范
Application Summary AI generated
This standard specifies the technical requirements, dimensions, and quality acceptance criteria for stamped leadframes used in plastic dual in-line package (DIP) semiconductor integrated circuits. It is applied in the manufacturing and procurement of leadframes for through-hole IC packaging, ensuring mechanical compatibility and reliability in automated assembly and soldering processes. The standard is primarily used by semiconductor packaging factories and component suppliers in China for quality control and inter-company verification.
Related Standards
GB/T 19403.1-2003
Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits)
GB/T 17574.10-2003
Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories
GB/Z 43510-2023
Integrated circuit TSV 3D package reliability test methods guideline
GB/T 19248-2003
Test method for measuring the resistance of package leads
GB/T 18500.2-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC)
GB/T 18500.1-2001
Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC)
GB/T 5965-2000
Semiconductor devices--Integrated circuits--Part 2:Digital integrated circuits--Section one--Blank detail specification for bipolar monolithic digital integrated circuit gates(excluding uncommitted logic arrays)
GB/T 17940-2000
Semiconductor devices--Integrated circuits--Part 3:Analogue integrated circuits
Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.