Browse Standards
1435+ standards in database
1435 result(s) found
电子设备机械结构 户外机壳 第3部分: 机柜和箱体的气候、机械试验及安全要求
Mechanical structures for electronic equipment--Outdoor enclosures--Part 3: Climatic，mechanical tests and safety aspects for cabinets and cases
电子设备机械结构 户外机壳 第2部分: 箱体和机柜的协调尺寸
Mechanical structures for electronic equipment--Outdoor enclosures--Part 2: Coordination dimensions for cases and cabinets
直热式阶跃型正温度系数热敏电阻器 第1-4部分:敏感用空白详细规范 评定水平EZ
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-4: Blank detail specification--Sensing application--Assessment level EZ
直热式阶跃型正温度系数热敏电阻器 第1-3部分:浪涌电流用空白详细规范 评定水平EZ
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-3: Blank detail specification--Inrush current application--Assessment level EZ
直热式阶跃型正温度系数热敏电阻器 第1-2部分:加热元件用空白详细规范 评定水平EZ
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-2: Blank detail specification--Heating element application--Assessment level EZ
半导体器件 第12-5部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的pin光电二极管空白详细规范
Semiconductor devices--Part 12-5: Optoelectronic devices--Blank detail specification for pin-photodiodes with/without pigtail，for fibre optic systems or subsystems
直热式阶跃型正温度系数热敏电阻器 第1-1部分:限流用空白详细规范 评定水平EZ
Thermistors--Directly heated positive step-function temperature coefficient--Part 1-1:Blank detail specification for current limiting application--Assessment level EZ
微波炉电容器 第1部分:总则
Capacitors for microwave ovens--Part 1:General
液晶和固态显示器件 第1部分:总规范
Liquid crystal and solid-state display devices--Part 1:Generic specification
半导体器件 第12-2部分:光电子器件 纤维光学系统或子系统用带尾纤的激光二极管模块空白详细规范
Semiconductor devices--Part 12-2:Optoelectronic devices--Blank detail specification for laser diodes modules with pigtail for fiber optic systems or sub-systems
半导体器件 第12-1部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的光发射或红外发射二极管空白详细规范
Semiconductor devices--Part 12-1:Optoelectronic devices--Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fiber optic systems or sub-systems
半导体器件 分立器件 第3-2部分:信号(包括开关)和调整二极管 电压调整二极管和电压基准二极管(不包括温度补偿精密基准二极管) 空白详细规范
Semiconductordevices--Discrete devices--Part 3-2:Signal (including switching) and regulator diodes--Blank detail specification for voltage-regulator diodes and voltage-reference diodes (excluding temperature-compensated precision reference diodes)
半导体器件 第12-4部分:光电子器件 纤维光学系统或子系统用带/不带尾纤的Pin-FET模块空白详细规范
Semiconductor devices--Part 12-4:Optoelectronicdevices--Blank detail specification for pin-FET modules with/without pigtailfor fiber optic systems or sub-systems
彩色投影显象管测试方法
Methods of measurement of the colour projectionpicture tubes
掺钕钇铝石榴石激光棒消光比的测量方法
Test method for extinction ratio of Nd∶YAG laser rods
激光棒波前畸变的测量方法
Test method for wavefront distortion of laserrods
频率低于3 MHz的矩形连接器 第8部分:具有4个信号接触件和电缆屏蔽用接地接触件的连接器详细规范
Rectangular connectors for frequencies below 3MHz--Part 8:Detail specification for connectors，four-signal contacts and earthing contacts for cable screen
频率低于3 MHz的印制板连接器 第7部分:有质量评定的具有通用插合特性的8位固定和自由连接器详细规范
Connectors for frequencies below 3MHz for use with printed boards--Part 7:Detail specification for connectors，8-way，including fixed and free connectors with common mating features，with assessed quality
钼钨合金丝
Molybdenum-tungsten alloy wire
彩色投影显象管空白详细规范
Blank detail specification for the colour projection picture tubes